JPH0361343U - - Google Patents
Info
- Publication number
- JPH0361343U JPH0361343U JP1989122462U JP12246289U JPH0361343U JP H0361343 U JPH0361343 U JP H0361343U JP 1989122462 U JP1989122462 U JP 1989122462U JP 12246289 U JP12246289 U JP 12246289U JP H0361343 U JPH0361343 U JP H0361343U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- sealing ring
- integrated circuit
- package
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 10
- 238000005219 brazing Methods 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989122462U JPH0361343U (en]) | 1989-10-19 | 1989-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989122462U JPH0361343U (en]) | 1989-10-19 | 1989-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361343U true JPH0361343U (en]) | 1991-06-17 |
Family
ID=31670460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989122462U Pending JPH0361343U (en]) | 1989-10-19 | 1989-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361343U (en]) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63208250A (ja) * | 1987-02-25 | 1988-08-29 | Nec Corp | 集積回路のパツケ−ジ構造 |
| JPS6427248A (en) * | 1987-03-09 | 1989-01-30 | Mitsubishi Electric Corp | Package for semiconductor |
-
1989
- 1989-10-19 JP JP1989122462U patent/JPH0361343U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63208250A (ja) * | 1987-02-25 | 1988-08-29 | Nec Corp | 集積回路のパツケ−ジ構造 |
| JPS6427248A (en) * | 1987-03-09 | 1989-01-30 | Mitsubishi Electric Corp | Package for semiconductor |